发明名称 |
METHOD FOR SENSING TEMPERATURE OF DIE |
摘要 |
A method for sensing is provided to minimize the error of the temperature sensing using band gap type temperature sensor. A method for sensing the temperature of die is as follows. In the reference temperature, the standards band gap voltage of the standards die is calculated(S410). In the first temperature, the first band gap voltage of the target die is measured(S420). Using the reference temperature, the standards band gap voltage, the first temperature and the first band gap voltage, the correlation between the band gap voltage of the target die and the temperature is set up(S430). The second band gap voltage of the target die is measured(S440). The measured second band gap voltage as described above and correlation are used to sense the second temperature corresponding to the second band gap voltage(S450).
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申请公布号 |
KR20090098229(A) |
申请公布日期 |
2009.09.17 |
申请号 |
KR20080023471 |
申请日期 |
2008.03.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM HYUNG SEUK;OAK, HEE SUK |
分类号 |
G01K7/00;G01K7/04;G01K7/16 |
主分类号 |
G01K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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