发明名称 METHOD FOR SENSING TEMPERATURE OF DIE
摘要 A method for sensing is provided to minimize the error of the temperature sensing using band gap type temperature sensor. A method for sensing the temperature of die is as follows. In the reference temperature, the standards band gap voltage of the standards die is calculated(S410). In the first temperature, the first band gap voltage of the target die is measured(S420). Using the reference temperature, the standards band gap voltage, the first temperature and the first band gap voltage, the correlation between the band gap voltage of the target die and the temperature is set up(S430). The second band gap voltage of the target die is measured(S440). The measured second band gap voltage as described above and correlation are used to sense the second temperature corresponding to the second band gap voltage(S450).
申请公布号 KR20090098229(A) 申请公布日期 2009.09.17
申请号 KR20080023471 申请日期 2008.03.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM HYUNG SEUK;OAK, HEE SUK
分类号 G01K7/00;G01K7/04;G01K7/16 主分类号 G01K7/00
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