| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation efficiency by improving heat conductive efficiency, while ensuring miniaturization. SOLUTION: A plurality of projections 15 are formed in a back surface of a base plate 10, and the base plate 10 is attached and arranged in a heat dissipating member 17 through a heat-conducting sheet 18 formed with a soft material as compared with the base plate 10. COPYRIGHT: (C)2009,JPO&INPIT |
