| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that in forming an external electrode of a multilayer electronic component by applying plating directly on an end face of a laminate when a distance between adjacent end parts of internal electrodes which are exposed on the end face is long, plating deposits is hardly bridged, which hinders the formation of a continuous plating film and eventually decreases the reliability. <P>SOLUTION: In order to form an external electrode 8, a plurality of conductive particles 10 having a grain diameter of 1μm or above are deposited on an end face 6 of a laminate 5 by sandblasting or brush polishing. Thereafter, a plating film 12 is formed by electrolytic plating or electroless plating. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
