| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a printed wiring board capable of effectively preventing occurrence of defect such that a top width of wiring is made narrower than the designed value by side etching of a plated layer, and free from the occurrence of problems about positioning or resistance increase particularly even when a semiconductor chip or the like is mounted, and also to provide a copper lining laminated plate, a flexible copper lining laminated plate and a method of manufacturing the same. SOLUTION: The substrate 1 for the printed wiring board has a plurality of metal plated layers 16, 17, 18 laminated on a surface of a substrate 11 having conductivity 12, 13 and in the plurality of metal plated layers, at least the etching rate of the surface layer 18 is made smaller than that of the bottom layer 16 in contact with the substrate surface. The flexible copper lining laminated plate 1 has the metal plated layers 16, 17 and 18 formed on the surface of plastic film 11 having conductivity, wherein metal having lower etching rate than that of copper contained in the metal plated layers 16, 17 and 18 is made larger gradually or stepwise from the plastic film toward the exposed surface. COPYRIGHT: (C)2009,JPO&INPIT
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