| 摘要 |
The invention discloses a dissipative vibration damping device (1), comprising a carrier (2) having an inner surface and an outer surface, the carrier being comprising on at least one surface thereof a bonding layer (3), wherein the carrier (2) is dissipative and has a damping loss factor of at least 0.2 and wherein the bonding layer (3) is made of a rigid material with higher stiffness than the carrier (2). Also disclosed is a system and a method using such dissipative damping device.
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