| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser processing device and a laser processing method by which the taper angle of a hole formed by laser processing can be adjusted as desired. <P>SOLUTION: The laser processing device 11 is provided with a first shift mechanism 31 composed of a first transparent member 41 having a first incident surface 43 and a first exit surface 44 which are parallel to each other and of a first motor 42 for causing the first transparent member 41 to pivot about a first pivot axis, and the first shift mechanism 31 shifts to a first direction a laser beam L exited from the first exit surface 44 in a direction parallel to a beam incident on the first incident surface 43. The laser processing device 11 is also provided with a second shift mechanism 32 composed of a second transparent member 46 having a second incident surface 48 and a second exit surface 49 which are parallel to each other and of a second motor 47 for causing the second transparent member 46 to pivot about a second pivot axis, and the second shift mechanism 32 shifts to a second direction a laser beam L exited from the second exit surface 49 in a direction parallel to a beam incident on the second incident surface 48. A beam collecting lens 22 collects the laser beam L shifted by the second shift mechanism 32 and processes work W1. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
