| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability associated with electric connections. <P>SOLUTION: A semiconductor module comprises a semiconductor chip 10 where an integrated circuit 12 is formed, electrodes 14 formed on the semiconductor chip 10 and electrically connected to the integrated circuit 12, an insulating film 16 having a plurality of openings positioned above the electrodes 14 and formed on the semiconductor chip 10, an elastic projection 18 disposed on the insulating film 16 and has a convex curved surface as a surface on the opposite side from the insulating film 16, wiring lines 20 extending from on the electrodes 14 to reach a top of the elastic projection 18, an elastic substrate 24 having leads 26 to come into contact with parts of the wiring lines 20 on the elastic projection 18, and an adhesive 22 holding an interval between the surface of the semiconductor chip 10 where the elastic projection 18 is formed and the surface of the elastic substrate 24 where the leads 26 are formed. The elastic substrate 24 has first hollows 28 formed by elastic deformation. Contact parts between the leads 26 and wiring lines 20 are formed on surfaces of the first hollows 28. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
