| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure method and an exposure apparatus that achieve improvement in throughput by reducing time required for alignment. <P>SOLUTION: The exposure method is used for exposing a substrate after aligning the substrate by utilizing marks formed on the substrate. The method includes: a first detection step for detecting a position of a first mark by a first scope; a second detection step for detecting a position of a second mark different from that of the first mark by a second scope having higher magnification than that of the first scope; a first calculation step for calculating a first correction value on the basis of the detection results of the first/second detection steps; a third detection step for detecting a position of a third mark different from each position of the first/second marks after aligning the substrate on the basis of the first correction value calculated in the first calculation step; a second calculation step for calculating a second correction value on the basis of the detection results of the second/third detection steps; and an exposure step that exposes the substrate after aligning the substrate on the basis of the second correction value calculated in the second calculation step. <P>COPYRIGHT: (C)2009,JPO&INPIT |
