| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a device wherein an adhesive film for die bonding is easily mounted on the rear side of each device divided by a point dicing method while the adhesive film overflowing from the peripheral edge of the device is not adhered to the surface of the device. SOLUTION: The manufacturing method of the device in which a wafer 2 is divided into each device 22 and the adhesive film is mounted on the rear side of the device comprises a process for forming divided grooves having depths each corresponding to the finished thickness of the device by being cut from the front surface side of the wafer along a street 21, a process for grinding the rear side of the wafer with a protective tape bonded to the front side to expose the divided groove on the rear side and divide it into individual devices, a process for mounting the adhesive film on the rear side of the divided wafers and a process for fracturing the adhesive film along the divided grooves by giving a tensile force to the adhesive film. When the finishing thickness of the device is shown by T, the width W of the dividing groove is set so as to be W≤1/2πT. COPYRIGHT: (C)2009,JPO&INPIT
|
