| 摘要 |
A printed wiring board includes an insulating layer and a capacitor including a ceramic high dielectric layer, a first electrode and a second electrode, the high dielectric layer being interposed between the first and second electrodes. A plurality of resin insulating layers are formed on the insulating layer and include an upper resin insulating layer provided on a first electrode side of the capacitor, and a lower resin insulating layer provided on a second electrode side of the capacitor. A semiconductor device mounting pad includes a first pad and a second pad, the semiconductor device mounting pad being formed on an outermost resin insulating layer of the resin insulating layers, and a first via conductor is formed in at least one of the resin insulating layers to electrically connect the first pad with the first electrode. A second via conductor is formed in at least another one layer of the resin insulating layers to electrically connect the second pad with the second electrode, and an underfill covered area covered with an underfill resin is provided between the semiconductor device and the printed wiring board. The underfill covered area is provided on a surface of the printed wiring board facing the semiconductor device. When the underfill covered area is projected along a lamination direction of the resin insulating layers to a face on which the high dielectric layer is formed, the underfill covered area is larger than an area in which the high dielectric layer is formed. The capacitor is located under the underfill covered area. |
