STACK PACKAGE AND METHOD FOR FABRICATING OF THE SAME

摘要

A stack package and a manufacturing method thereof are provided to remove an adhesive tape or filler between stacked semiconductor chips by performing electrical or physical connection through a wire with the same area and size. A plurality of bonding pads(104) and via holes are formed in an upper surface of a semiconductor chip(100). A first wiring(110) is individually connected to each bond pad in the upper side including a via hole surface of each semiconductor chip. A second wiring(120) is individually connected to the first wiring of each via hole surface in a lower part of each semiconductor chip. The first wiring of the semiconductor chip arranged in the upper side is bonded with the second wiring of the semiconductor chip arranged in the lower side. The first and second wirings have a mutual mirror structure. The first and second wiring have the thickness of 1 to 3 um.