发明名称 LASER PROCESSING METHOD
摘要 A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 23 holding an object to be processed 1 while being stuck to a frame 51 is secured by suction onto a suction table 52 of a vacuum chuck with a porous sheet 53 interposed therebetween. Since the sheet 53 has a Young's modulus lower than that of the table 52, the tape 23 is restrained from biting into fine pores of the sheet 53. As a consequence, even when the table 52 and tape 23 are separated from each other by releasing the suction securing after forming a modified region 7, no strong bending stress acts on the object 1. This can prevent the object 1 from being cut along a line to cut from the modified region 7 acting as a cutting start point when separating the table 52 and tape 23 from each other.
申请公布号 EP1959482(A4) 申请公布日期 2009.09.16
申请号 EP20060832750 申请日期 2006.11.16
申请人 HAMAMATSU PHOTONICS KABUSHIKI KAISHA 发明人 MURAMATSU, KENICHI;SAKAMOTO, TAKESHI
分类号 H01L21/301;B23K26/10;B23K101/40 主分类号 H01L21/301
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