发明名称 |
LASER PROCESSING METHOD |
摘要 |
A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 23 holding an object to be processed 1 while being stuck to a frame 51 is secured by suction onto a suction table 52 of a vacuum chuck with a porous sheet 53 interposed therebetween. Since the sheet 53 has a Young's modulus lower than that of the table 52, the tape 23 is restrained from biting into fine pores of the sheet 53. As a consequence, even when the table 52 and tape 23 are separated from each other by releasing the suction securing after forming a modified region 7, no strong bending stress acts on the object 1. This can prevent the object 1 from being cut along a line to cut from the modified region 7 acting as a cutting start point when separating the table 52 and tape 23 from each other. |
申请公布号 |
EP1959482(A4) |
申请公布日期 |
2009.09.16 |
申请号 |
EP20060832750 |
申请日期 |
2006.11.16 |
申请人 |
HAMAMATSU PHOTONICS KABUSHIKI KAISHA |
发明人 |
MURAMATSU, KENICHI;SAKAMOTO, TAKESHI |
分类号 |
H01L21/301;B23K26/10;B23K101/40 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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