发明名称 Forked probe for testing semiconductor devices
摘要 A novel forked probe design for use in a novel probe card is presented that comprises a forked bending element that more efficiently stores displacement energy. Specifically, the novel probe card comprising a substrate and a forked probe connected to the substrate. The forked probe includes a base that is connected to the substrate and a forked bending element connected to the base, wherein the forked bending element comprises at least a first prong connected to a second prong through a prong connecting structure and a handle connected to the prong connecting structure. Connected to the first prong is the probe tip that is adapted to make contact with the DUT. Refinements to the probe card include that the first and second prongs are adapted to bend such that each prong elastically stores a portion of the displacement energy when the probe tip contacts the DUT. Also, the forked bending element may be manufactured using photolithography and using layered photolithography. Each prong may be comprised of different materials. And the forked bending element may be comprised of a nickel alloy. Also, the first prong may be constructed to be stiffer than the second prong, which may yield a shorter scrub length. The stiffness of the prongs may be manipulated by altering the geometry and/or material of the prongs.
申请公布号 US7589547(B2) 申请公布日期 2009.09.15
申请号 US20070855094 申请日期 2007.09.13
申请人 TOUCHDOWN TECHNOLOGIES, INC. 发明人 ISMAIL SALLEH
分类号 G01R31/02 主分类号 G01R31/02
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