发明名称 METHOD OF SUPPLYING A SEMICONDUCTOR MODULE AND APPARATUS FOR SUPPLYING A SEMICONDUCTOR MODULE
摘要 A method of supplying a semiconductor module and an apparatus for supplying a semiconductor module are provided to prevent damage to the semiconductor module input an apparatus by supplying a semiconductor module to a main unit when an inputting direction of the semiconductor is in concord with a set direction. In a method of supplying a semiconductor module and an apparatus for supplying a semiconductor module, a semiconductor module(150) is prepared. The front side and backplane of the semiconductor module are tested by using a slot formed in the semiconductor module. The semiconductor module is transferred to a main processing unit(500) in case that the front side and backplane of the semiconductor module are concord with the set side. The supply of the semiconductor module is stopped in case that the front side and backplane of the semiconductor module does not coincide with the set side.
申请公布号 KR20090096881(A) 申请公布日期 2009.09.15
申请号 KR20080021957 申请日期 2008.03.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, CHUL JUN;SHIN, YONG SOO;HWANG, JAE WOONG
分类号 H01L21/70 主分类号 H01L21/70
代理机构 代理人
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