| 摘要 |
<p>A semiconductor package and a manufacturing method thereof are provided to perform a wire bonding on a relocation conductive layer by laminating the relocation conductive layer with heterogeneous material. A plurality of relocation conductive layers(150,170) is laminated on a top of a semiconductor chip(100). An electrode pad(110) is locally exposed by a protective layer(120) on a top surface of the semiconductor chip. One end of a first relocation conductive layer(150) is connected to the electrode pad. The other end of the first relocation conductive layer is connected to an external circuit board. A second relocation conductive layer(170) is made of material which prevents a formation of a thick oxide film or an uneven oxide film formed on the first relocation conductive layer. A UBM(uner bump metal) base layer(130) is formed on a top surface of the electrode pad. A protective layer(180) is formed on the relocation conductive layer.</p> |
