| 摘要 |
<p>Disclosed is a method for manufacturing a multilayer printed wiring board, which improves connection between a conductor circuit and a via conductor, while satisfying miniaturization demands for the conductor circuit. Specifically disclosed is a method for manufacturing a multilayer printed wiring board, which is characterized by comprising a step of forming a first interlayer resin insulating layer; a step of forming a first conductor circuit on the first interlayer resin insulating layer; a step of forming a second interlayer resin insulating layer on the first conductor circuit and the first interlayer resin insulating layer; a step of forming an opening in the second interlayer resin insulating layer, which opening reaches the first conductor circuit; a step of forming an electroless plating film on the surface of the interlayer resin insulating layer and the exposed surface of the first conductor circuit which is exposed from the opening; a step of forming a plating resist on the electroless plating film; a step of replacing the electroless plating film formed on the exposed surface with a thin-film conductor layer having a lower ionization tendency than the electroless plating film and containing the same metal as the exposed surface of the first conductor circuit; a step of forming an electrolytic plating film composed of the same metal as described above on the portion where the plating resist is not formed and on the thin-film conductor layer; a step of separating the plating resist; and a step of removing the electroless plating film which is exposed by the separation of the plating resist.</p> |
