SUBSTRATE FILM FOR BACK GRINDING AND FORMING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a substrate film for back grinding that prevents a semiconductor wafer from being warped easily and has superior stability in dimension in a back grinding process of the thin-type semiconductor wafer. SOLUTION: In the substrate film for back grinding and a forming method thereof, the substrate film for back grinding has a hydrogen additive of a vinyl aromatic hydrocarbon-conjugated diene hydrocarbon copolymer and a (meta) acrylic acid alkylester-based polymer. COPYRIGHT: (C)2009,JPO&INPIT