| 摘要 |
A semiconductor package is provided to reduce electrical resistance of a semiconductor package by increase contact area of a conductive particle in a pump and an anisotropic conductive film. In a semiconductor package, a plurality of connection pads(112) is equipped in a substrate(110). A semiconductor chip(120) is arranged on the top of the substrate and has a plurality of bonding pads. A plurality of first bumps(134) are arranged so that it is separated from a connection pad and a bonding pad. The first pump is made of the gold(Au) or a lamination film of the gold(Au) and the nickel(Ni), and a second bump(132) is equipped between the first bump and the bonding pad. A second bump is made of the copper(Cu) or the nickel(Ni).
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