发明名称 |
HEAT-EMITTING ELEMENT COOLING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat-emitting element cooling apparatus enhancing cooling effect on a heat-emitting element as well as reducing noise. SOLUTION: A heat sink 3 includes a core portion 7 and a plurality of radiation fins 9 fixed to the core portion 7. Dimensions of the core portion 7 and the radiation fins 9 are defined in such a manner that the diameter L1 of the core portion 7 should be 37% to 45% of the diameter L2 of a shape depicted by a virtual connecting line 13. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009206404(A) |
申请公布日期 |
2009.09.10 |
申请号 |
JP20080049538 |
申请日期 |
2008.02.29 |
申请人 |
SANYO DENKI CO LTD |
发明人 |
WATANABE MICHITOKU;MARUYAMA HARUHISA;OGAWARA TOSHIKI;UENO KOJI |
分类号 |
H01L23/36;H01L23/467;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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