发明名称 HEAT-EMITTING ELEMENT COOLING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat-emitting element cooling apparatus enhancing cooling effect on a heat-emitting element as well as reducing noise. SOLUTION: A heat sink 3 includes a core portion 7 and a plurality of radiation fins 9 fixed to the core portion 7. Dimensions of the core portion 7 and the radiation fins 9 are defined in such a manner that the diameter L1 of the core portion 7 should be 37% to 45% of the diameter L2 of a shape depicted by a virtual connecting line 13. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009206404(A) 申请公布日期 2009.09.10
申请号 JP20080049538 申请日期 2008.02.29
申请人 SANYO DENKI CO LTD 发明人 WATANABE MICHITOKU;MARUYAMA HARUHISA;OGAWARA TOSHIKI;UENO KOJI
分类号 H01L23/36;H01L23/467;H05K7/20 主分类号 H01L23/36
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