Rückseitenimmersionslithographie

摘要

The present disclosure relates to formation of latent images in a radiation sensitive layer applied to a substrate that is transparent to or transmissive of radiation at the exposing wavelength. In particular, it relates to so-called backside lithography, in which the final lens of an exposing system is positioned to project electromagnetic radiation through a first side of the transparent substrate and expose a radiation sensitive layer that overlays a second side of the transparent substrate that is opposite the first side. Five alternative embodiments for further treatment to form a radiation opaque layer corresponding to the latent image (the image or its inverse) are described. These methods and corresponding devices are useful for producing masks (sometimes called reticles), for producing latent images in semiconductor devices and for forming features of semiconductor devices using masks.