| 摘要 |
In a method and apparatus of aligning a substrate, a mark image may be generated from an alignment mark on the substrate. The mark image may be generated after a given process for manufacturing a semiconductor device including the substrate has been performed. The mark image may be compared with a given reference image, and the substrate may be aligned based on the comparison, so that the alignment mark corresponds to one of the reference image and the mark image. The alignment method may be used in a method of inspecting the substrate, wherein the process after which the mark image is created is performed in accordance with a process recipe to form a pattern. The inspection method may include inspecting whether the pattern from the aligned substrate corresponds to the process recipe.
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