| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting apparatus attaining a high outputting of an optical output of a light-emitting device and preventing a poor bonding between a base substrate and a frame substrate. <P>SOLUTION: A mounting substrate 2 includes: a base substrate 20; and an interlayer substrate (frame substrate) 30. With respect to the base substrate 20, at one front surface side of a silicon substrate 20a, there is formed a metal layer 29 for bonding a metal layer 25a<SB>1</SB>for mount which has a plane size bigger than a light-emitting device 1 bonded to a center part by wax material and the interlayer substrate 30. Simultaneously a plurality of thermal vias 26 are formed in the whole region of a projection region of the metal layer 25a<SB>1</SB>for mount. At the one front surface side of the silicon substrate 20a, there are formed a connection metal layer 25c electrically connecting the metal layer 25a<SB>1</SB>for mount and the metal layer 29 for bonding and carrying out a thermal coupling thereof and a wetting spreading suppression portion 21 preventing the wax material from getting wet and spreading to the metal layer 29 for bonding. <P>COPYRIGHT: (C)2009,JPO&INPIT |
