发明名称 WAFER SUPPORT MEMBER, SEMICONDUCTOR MANUFACTURING DEVICE, AND MANUFACTURING METHOD OF WAFER
摘要 PROBLEM TO BE SOLVED: To prevent a gas leak from being caused as a brazing material layer joining a ceramic plate body and a cylindrical body forming a wafer support member corrodes with a corrosive gas. SOLUTION: The wafer support member includes a ceramic plate body having a mount surface where a wafer is placed on one principal surface, the cylindrical body having an end joined to the other principal surface of the ceramic plate body through the brazing material layer, and a gas supply unit which supplies a gas to nearby a side end on an outer peripheral side of the brazing material layer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009206202(A) 申请公布日期 2009.09.10
申请号 JP20080045091 申请日期 2008.02.26
申请人 KYOCERA CORP 发明人 MAEHARA TATSUYA
分类号 H01L21/683;C23C16/458;H01L21/205;H01L21/3065 主分类号 H01L21/683
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