发明名称 WIRING BOARD AND MOUNTING STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board and a mounting structure having superior reliability by preventing an insulating layer from separating from a basic substance. <P>SOLUTION: The wiring board 2 includes: the basic substance 5; a conductive layer 6 formed on the basic substance 5; and the insulating layer 7 covering the conductive layer 6. The part of the basic substance 5 that is located around an end 6ax of the conductive layer 6 is raised, and the peak 9b of a raised portion 9a is located between the level of the lower surface of the conductive layer 6 and the level of the upper surface of the conductive layer 6. A gap G is formed between the raised portion 9a and the end 6ax of the conductive layer 6, and part of the insulating layer 7 fills the gap G between the raised portion 9a and the end 6ax of the conductive layer 6. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009206250(A) 申请公布日期 2009.09.10
申请号 JP20080045933 申请日期 2008.02.27
申请人 KYOCERA CORP 发明人 FUJISAKI SHOYA;HAYASHI KATSURA
分类号 H05K3/46;H05K1/11 主分类号 H05K3/46
代理机构 代理人
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