发明名称 Semiconductor device fabricating method
摘要 There is provided a method of fabricating a semiconductor device in which a gate electrode is formed on an oxide film, which is formed by thermal oxidation on a substrate. The fabrication method includes: a first step of forming a first oxide film on the substrate; a second step of thermally processing the first oxide film in an inactive gas atmosphere; a third step of forming a second oxide film that is obtained by etching the first oxide film, which has been thermally processed in the inactive gas, to a predetermined film thickness; and a fourth step of forming and thermally processing a gate electrode on the second oxide film.
申请公布号 US2009227098(A1) 申请公布日期 2009.09.10
申请号 US20090320714 申请日期 2009.02.03
申请人 OKI SEMICONDUCTOR CO., LTD. 发明人 MATSUYAMA ISAMU
分类号 H01L21/4763 主分类号 H01L21/4763
代理机构 代理人
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