发明名称 |
Method of Forming Solid Vias in a Printed Circuit Board |
摘要 |
A method is described by which an electrical path is created between layers on a printed circuit board (PCB) without the use of plated through holes (PTH). Through the use of a liquid solder or conductive epoxy injection fixture, a conductive path is created in pre-drilled holes forming an electrical connection between internal PCB metal layers and surface mounted components without the creation of parasitic stubs on the signal nets.
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申请公布号 |
US2009223710(A1) |
申请公布日期 |
2009.09.10 |
申请号 |
US20080043994 |
申请日期 |
2008.03.07 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BECKER WIREN DALE;MCALLISTER MICHAEL FORD;STIGLIANI ALAN DANIEL;TOROK JOHN G. |
分类号 |
H05K1/11;H05K3/10 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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