VACUUM DEPOSITION METHOD

摘要

Vacuum deposition process for depositing at least one thin film on a surface portion of a substrate, characterized in that: at least one sputtering species that is chemically inactive or active with respect to a material to be sputtered is selected; a collimated beam of ions comprising predominantly said sputtering species is generated using at least one linear ion source positioned within an installation of industrial size; said beam is directed onto at least one target based on the material to be sputtered; and at least one surface portion of said substrate is positioned so as to face said target in such a way that said material sputtered by the ion bombardment of the target or a material resulting from the reaction of said sputtered material with at least one of the sputtering species is deposited on said surface portion.