| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate dividing method capable of improving accuracy of a devided cross section of a substrate. <P>SOLUTION: Substrates 1, 2 are divided by forming a reformed area 5 therein by emitting a laser beam along the dividing line of the substrates 1, 2. The substrates 1, 2 with the reformed area 5 formed are immersed in an etching liquid 6 for fusing the substrate material to remove micro cracks of the reformed area 5 by fusion. As a result, with the micro cracks of the reformed area 5 removed, the accuracy of the cross section in dividing the substrate is improved and, in addition, the wall of the reformed area 5 is also removed by fusion, resulting in improvement in the accuracy of the cross section. With the reformed area 5 formed inside from the end face of the substrates 1, 2, and with the entire end face of the substrates 1, 2 is fused prior to the fusion of the micro cracks of the reformed areas 1, 2, the thickness of the substrates 1, 2 are made thinner. Consequently, the substrates 1, 2 for which thinness is required as a TFT substrate for cellular phones can be divided with high accuracy in divided cross section. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
