| 摘要 |
A photosensitive resin composition, and a photosensitive resin laminate using the composition are provided to improve the resolution after development, the shape of resist pattern and adhesion, to enhance sandblast resistant adhesion and to reduce developing time. A photosensitive resin composition comprises 20~80 mass% of an alkali-soluble polymer; 10~70 mass% of a polyurethane prepolymer represented by the formula 1; 5~60 mass% of a addition-polymerizable monomer having at least one terminal ethylenically unsaturated group; and 0.01~20 mass% of a photopolymerization initiator, wherein R1 is a hydrogen atom or a methyl group; R2 is a hydrogen atom, an alkyl group of the carbon atom number 1~10, or a halogen atom; a and b are an integer of 0-2; and 0<=a+b<=4. |
