| 摘要 |
A microelectronic assembly that includes a first microelectronic element having a first rear surface. The assembly further includes a second microelectronic element having a second rear surface. The second microelectronic element is attached to the first microelectronic element so as to form a stacked package. A bridging element electrically connects the first microelectronic element and the second microelectronic element. The first rear surface of the first microelectronic element faces toward the second rear surface of the second microelectronic element. |
