| 摘要 |
By means of the disclosed Cu-Co-Si alloy material-which contains 1.5-2.5 wt% Co and 0.3-0.7 wt% Si, has an element ratio Co/Si of 3.5-5.0, contains 3,000-150,000 particles/mm2 of second-phase particles having a diameter of at least 0.20 µm and less than 1.00 µm, has a crystal grain size of no more than 10 µm, has a conductivity of at least 60% IACS, and has favorable bending workability-a copper alloy material was achieved that has excellent bending workability, can become highly conductive, and is suited as a material for electronic/electrical apparatuses such as a mobile connector. The abovementioned alloy material contains 10-1,000 particles/mm2 of second-phase particles having a diameter of 1.00-5.00 µm, optionally has a 0.2% yield strength of at least 600 MPa, and can be produced after casting with the temperature of heating performed before solution treatment being a temperature at least 45°C higher than the belowmentioned solution treatment temperature, the cooling rate from a hot rolling start temperature to 600°C being no more than 100°C/min, the solution treatment temperature being selected from at least (50×Cowt%+775)°C and no more than (50×Cowt%+825)°C, and an aging treatment after the solution treatment being preferably at 450-650°C for 1-20 hours. |
