发明名称 Semiconductor device and method for fabricating the same
摘要 A gate electrode is formed on a silicon substrate, and then source/drain regions are formed at both sides of the gate electrode in the silicon substrate. Thereafter, an alloyed silicide layer is formed on the source/drain regions. The step of forming the alloyed silicide layer includes the step of depositing a first metal film, a nickel film and a second metal film in this order to form a multilayer metal film and the step of performing heat treatment after the formation of the multilayer metal film.
申请公布号 US7585767(B2) 申请公布日期 2009.09.08
申请号 US20060356959 申请日期 2006.02.21
申请人 PANASONIC CORPORATION 发明人 OKUNO YASUTOSHI;MATSUMOTO MICHIKAZU
分类号 H01L21/44 主分类号 H01L21/44
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