ION IMPLANTING APPARATUS AND ION IMPLANTING METHOD

摘要

At the time of injecting ions of positive charges into an object substrate, a charge-up damage may occur in the object substrate. In order that the object substrate may be less charged up by emitting secondary electrons at the time of injecting the ions of positive charges, a conductive member is disposed at a position to confront the object substrate, thereby to ground the conductive member electrically in high frequencies to the earth. Alternatively, the field intensity to occur in the object substrate may also be reduced by controlling the RF power to be applied to the object substrate, in a pulsating manner.