COATING COMPOSITION FOR PRINTED CIRCUIT BOARD

摘要

A coating composition for printed circuit boards is provided to exhibit strong cohesive power when lamination-molding a multiayered printed circuit board and to replace a blackening treatment process and acid etching process. A coating composition for printed circuit boards comprises (i) water-soluble .01-10 parts by weight, (ii) silane compound 0.05-15 parts by weight, (iii) thermal initiator 0.001-1 parts by weight, (iv) at least one salt 0.01-10 parts by weight selected from the group consisting of acetate, glycolate, lactate, gluconate, citrate and succinate, (v) alcohol 0.01-10 parts by weight, and (vi) water 40-95 parts by weight.