| 发明名称 |
LEAD SOLDER INDICATOR AND METHOD |
| 摘要 |
<p>1 1 LEAD SOLDER INDICATOR AND METHOD ABSTRACT OF THE DISCLOSURE A SOLDER SYSTEM (14) INCLUDES A LEAD (PH) INDICATOR AND A SOLDER FLUX. A METHOD FOR 5 FORMING A SEMICONDUCTOR DEVICE INCLUDES PROVIDIN.- A CARRIER (52), APPLYING THE SOLDER SYSTEM TO THE CARRIER (54), COUPLING THE TERMINAL TO THE CARRIER VIA THE SOLDER SYSTEM (56), MELTING THE SOLDER SYSTEM TO ATTACH THE TERMINAL TO THE CARRIER AND FORM A COMPLETED SEMICONDUCTOR DEVICE (58), AND DETERN-LINING IF THE COMPLETED SEMICONDUCTOR DEVICE HAS A DIFFERENT PREDETERMINED PROPERTY FROM THE SOLDER SYSTEM (60). 0</p> |
| 申请公布号 |
MY139006(A) |
申请公布日期 |
2009.08.28 |
| 申请号 |
MY2005PI02523 |
申请日期 |
2005.06.02 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
TERRY E. BURNETTE;THOMAS H. KOSCHMIEDER |
| 分类号 |
H01L21/66;H01L21/44;H01L21/48;H01L21/50;H01L21/60;H01L23/48;H01L23/498;H01L23/52;H01L23/544;H01L29/40;H05K1/02;H05K3/34 |
主分类号 |
H01L21/66 |
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