POSITIONING APPARATUS AND METHOD

摘要

Manufacturing of semiconductor devices is fully automated for cost savings to be achieved in terms of capital and material costs. Semiconductor devices separated from the lead-frames or substrates are typically washed and dried before being transferred to a plate. The semiconductor devices are then subsequently transferred from the plate to a holding tray. However, the large contact surface between the semiconductor devices and the plate results in the semiconductor devices adhering to the surface of the plate when transferring the semiconductor devices to the holding tray. Furthermore, misalignment also tends to occur when the devices are transferred from the plate to the holding tray due to gravitational displacement of the semiconductor devices occurring during the transfer. An embodiment of the invention describes an apparatus and a method for transferring semiconductor devices into component pockets of holding trays.