| 摘要 |
PROBLEM TO BE SOLVED: To provide an adapter having a structure capable of mounting via a socket, even in a semiconductor package that uses a plate-like terminal. SOLUTION: A plate-like connector 9 is installed on the side face of a plate-like package 1. The adapter 3 has dimensions that are substantially the same size as that of the package 1, and a connecting pin 17 is installed on it. One end of the connecting pin 17 protrudes on the upper side of the adapter 3, and a cut-out part 23 is provided on the side face. A solder ball 21 is connected to the connecting pin 17 at the bottom side of the adapter 3. The socket 5 has dimensions of almost the same size as that of the adapter 3, and a hole-like terminal 27 is installed and a solder ball 29, which is connected to a substrate is installed at the end part of the hole-like terminal 27. When the package 1 is mounted on the substrate, first, the connector 9 is engaged with the cut-out part 23 of the connecting pin 17 of the adapter 3. Next, the socket 5 is connected to the substrate, and the adapter 3 is inserted into the socket 5. COPYRIGHT: (C)2009,JPO&INPIT
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