CURABLE COMPOSITION

摘要

Provided is a curable composition with a high curing speed, that includes as a hardening component a polymer (A) containing a reactive silicon group, and contains no or almost no metal-organic compounds. An amidine derivative salt represented by formula (2) is included as a curing catalyst. [Compound 1] (In formula 2, R2 represents a hydrocarbon group or a hydrogen atom; R3 and the two R4s each independently represent organic groups or hydrogen atoms; R5 represents a hydrocarbon group with 1 to 25 carbon atoms, or a hydrogen atom; and X2 represents an organic acid ion, an inorganic acid ion, or a hydroxyl group. It is also allowable for any two or more of the following to bond and form a cyclic structure: R2, R3, and the two R4s.)