| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent damage occurring at an electrical signal connecting portion effectively when a plurality of wafers are stuck and can ensure excellent reliability and stabilized performance. <P>SOLUTION: A plurality of wafers 1WA and 1WB composed of substrates 1SA and 1SB on which elements are formed are stuck, electrical signal connecting portions 9, 26 are provided on the surfaces 30a, 30b of a wafer 1WA, 1WB which are stuck to another wafer, at least one of the electrical signal connecting portions 9 and 26 facing each other is formed to protrude from the sticking surface 30a where the substrate 1SA is exposed, and a reinforcing protrusion 52 composed of the same material as that of the substrate 1SA and insulated from a semiconductor circuit is formed to be protruded from the sticking surface 30a with a height equal to the dimension of an interval between the stuck wafers 1WA and 1WB in a region on the sticking surface 30a where the protruding connecting portion is formed but the electrical signal connecting portion is not arranged, thus obtaining a semiconductor device. <P>COPYRIGHT: (C)2009,JPO&INPIT |
