| 摘要 |
A curable precursor composition for preparing a vibration dampening composition having a density of less than 0.9 g/cm3 said precursor composition comprising (i) one or more rigid epoxy resin (ii) one or more flexible epoxy resin, (iii) a first set of hollow microspheres, (iv) a second set of hollow microspheres wherein the microspheres of the first set are different in composition from the microspheres of the second set and, a curing agent capable of cross-linking the rigid and flexible epoxy resins. Also provided are vibration dampening compositions obtainable from the precursor compositions and methods of preparing such vibration dampening compositions.
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