发明名称 METHOD OF MANUFACTURING A BURIED-GATE SEMICONDUCTOR DEVICE AND CORRESPONDING INTEGRATED CIRCUIT
摘要 A semiconductor device includes a semiconductor channel region and a gate region, wherein the gate region includes at least one buried part extending under the channel region. The buried part of the gate region is formed from a cavity under the channel region. The cavity is filled with a first material. An opening is made to access the first material. In one implementation, aluminum is deposited in the opening in contact with the first material. An anneal is performed to cause the aluminum to be substituted for the first material in the cavity. In another implementation, a second material different from the first material is deposited in the opening. An anneal is performed to cause an alloy of the first and second materials to be formed in the cavity.
申请公布号 US2009212333(A1) 申请公布日期 2009.08.27
申请号 US20090370304 申请日期 2009.02.12
申请人 STMICROELECTRONICS (CROLLES 2) SAS;STMICROELECTRONICS (GRENOBLE) SAS;COMMISSARIAT A L'ENERGIE ATOMIQUE 发明人 BERNARD EMILIE;GUILLAUMOT BERNARD;CORONEL PHILIPPE;VIZIOZ CHRISTIAN
分类号 H01L29/78;H01L21/336;H01L21/36;H01L21/4763 主分类号 H01L29/78
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