| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology achieving highly accurate alignment of a semiconductor chip with a mounted substrate by increasing perceptibility of an alignment mark. <P>SOLUTION: In the semiconductor chip constituting an LCD driver, a mark MK1 is formed in an alignment mark forming area on a semiconductor substrate 1S. The mark MK1 is formed on the same layer as upper-most layer wiring (third-layer wiring L3) in an integrated circuit forming area. Patterns P1a, P1b, P2, P3 are formed on lower layers of the mark MK1 and a background area surrounding the mark MK1. The pattern P1a is formed on th same layer as second-layer wiring L2 and the pattern P1b is formed on the same layer as first-layer wiring L1. The pattern P2 is formed on the same layer as a gate electrode G and the pattern P3 is formed on the same layer as an element separation area ST1. <P>COPYRIGHT: (C)2009,JPO&INPIT |
