| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that collision between a wafer and a boat, or the like, may occur when wafer is carried by a wafer transporting robot, since, in a vertical mold furnace, position shift, and the like, is not monitored quantitatively and periodically, after adjustment related to a wafer transporting position, and the like, has been once carried out manually to the boat, although the vertical mold furnace for a butch process carries the wafer to a vertical boat by a transport robot arm and inserts the boat to the furnace body to carry out a process processing. SOLUTION: A method of manufacturing a semiconductor apparatus includes monitoring a relation between a reference height, over a wafer processing boat and a wafer height for holding the wafer to a transport mechanism, in a state of holding the wafer to the transporting mechanism, when the wafer to the wafer processing boat of the wafer, and the like, is loaded and automatically and preliminarily detecting the probability of the occurrence of undesired collision or contact or the like between any two of the wafer, the boat, or the transporting mechanism, based on the monitored result. COPYRIGHT: (C)2009,JPO&INPIT
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