发明名称 PHOTOSENSITIVE COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE COMPOSITION AND COMPOUND USED FOR THE PHOTOSENSITIVE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition which ensures few development defects and good line edge roughness in normal exposure (dry exposure) and liquid immersion lithography. <P>SOLUTION: The photosensitive composition includes (A) a resin whose solubility in an alkali developer increases by the action of an acid and (A') a resin having a sulfonium structure corresponding to a compound represented by a specific general formula. The compound used for the photosensitive composition and the pattern forming method using the photosensitive composition are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009192618(A) 申请公布日期 2009.08.27
申请号 JP20080030640 申请日期 2008.02.12
申请人 FUJIFILM CORP 发明人 WADA KENJI
分类号 G03F7/004;C08F20/10;G03F7/039;G03F7/11;H01L21/027 主分类号 G03F7/004
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