发明名称 |
PHOTOSENSITIVE COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE COMPOSITION AND COMPOUND USED FOR THE PHOTOSENSITIVE COMPOSITION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition which ensures few development defects and good line edge roughness in normal exposure (dry exposure) and liquid immersion lithography. <P>SOLUTION: The photosensitive composition includes (A) a resin whose solubility in an alkali developer increases by the action of an acid and (A') a resin having a sulfonium structure corresponding to a compound represented by a specific general formula. The compound used for the photosensitive composition and the pattern forming method using the photosensitive composition are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009192618(A) |
申请公布日期 |
2009.08.27 |
申请号 |
JP20080030640 |
申请日期 |
2008.02.12 |
申请人 |
FUJIFILM CORP |
发明人 |
WADA KENJI |
分类号 |
G03F7/004;C08F20/10;G03F7/039;G03F7/11;H01L21/027 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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