| 摘要 |
PROBLEM TO BE SOLVED: To aim at the reduction in size while ensuring a dimension necessary for the insulation distance between a lead frame and a heat plate by joining and arranging the heat plate on a power module substrate so that the outer line of the heat plate is located inside the outer line of the power module substrate, and to configure a structure so that predetermined heat dissipating performance can be ensured as well as preventing thermal stress from converging onto the heat plate due to such the structure. SOLUTION: In a power module structure, a heat plate 5 is joined and arranged to another surface of a power module substrate 1 so that an outer line 5a of the heat plate 5 is located inside an outer line 1a of the power module substrate 1, and a dimension of separation L<SB>1</SB>between the outer line 5a of the heat plate 5 and the outer line 1a of the power module substrate 1 is set so as to be smaller than a dimension of thickness t<SB>1</SB>of the power module substrate 1. COPYRIGHT: (C)2009,JPO&INPIT |
