3-DIMENSIONAL INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To laminate a plurality of two-dimensional similar integrated circuits including a plurality of similar partial circuits having connections in the vertical direction, without complicating the three-dimensional laminating process of the two-dimensional integrated circuit. SOLUTION: In the three-dimensional integrated circuit, at least two partial circuits are disposed in a rotationally symmetric position on the two-dimensional integrated circuit; a signal transmission channel connected to the upper layer of the partial circuit is arranged in the partial circuit in the rotationally symmetric position with the signal transmission channel connected to the lower layer of the partial circuit, and a plurality of the two-dimensional integrated circuit are rotated to be bonded to each other. COPYRIGHT: (C)2009,JPO&INPIT