发明名称 COOLING PLATES AND SEMICONDUCTOR APPARATUS THEREOF
摘要 A cooling plate includes a channel to transmit a fluid, wherein the channel is disposed within a base and the channel has a first portion and a second portion. The first portion is disposed substantially along a peripheral edge of the base, and the second portion is coupled to the first portion and is disposed further away from the peripheral edge of the base than the first portion. The second portion has a length that is at least about 35% as long as the length of the first portion. The cooling plate also includes a lid disposed over the base and the channel, wherein the lid provides support for a substrate.
申请公布号 US2009211742(A1) 申请公布日期 2009.08.27
申请号 US20080246020 申请日期 2008.10.06
申请人 APPLIED MATERIALS, INC. 发明人 LEE HELDER;SCHWARTZ MIRIAM;KUCHAR MICHAEL;WEBB AARON;COSTUROS THEODOSS
分类号 F28F3/12 主分类号 F28F3/12
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