RAPID SUPPLY OF FLUORINE SOURCE GAS TO REMOTE PLASMA FOR CHAMBER CLEANING

摘要

A system and method for performing rapid chamber cleaning is described. The use of F2 as the source gas for an RPS to form fluorine radicals used in the chamber cleaning operation allows chamber cleaning to proceed at an initial rapid rate without requiring ramp up of the cleaning gas flow. This results in more rapid cleaning and significantly shorter cleaning cycles. This is useful in semiconductor manufacturing, particular, for flat panel displays and solar photo voltaic devices.