| 发明名称 |
ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRONIC DEVICE AND ITS FABRICATION METHOD |
| 摘要 |
An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.
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| 申请公布号 |
US2009211796(A1) |
申请公布日期 |
2009.08.27 |
| 申请号 |
US20090432249 |
申请日期 |
2009.04.29 |
| 申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
CHINDA AKIRA;MIYAMOTO NOBUAKI;HIRASAWA KOKI;UCHIDA KENJI;MITA MAMORU |
| 分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
| 代理机构 |
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代理人 |
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