APPARATUS FOR POLISHING WAFER HAVING HEAD ASSEMBLY

摘要

An apparatus for polishing a wafer having a head assembly is provided to improve the response rate of air flow by forming a plurality of dimple on the interior surface of a buffer pressing a membrane. A pitted buffer part(113) is formed in single-side of a holder plate, and a membrane pressurizes a wafer as atmosphere is flowed in the buffer part. In the buffer part, a plurality of dimples(112) are formed at the upper part of the side facing the membrane. Dimples are consecutively formed. The inlet hole(114) in which atmosphere is flowed in through the center area of the holder plate within the buffer part is formed, and the membrane is made of the rubber material.